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Proceedings Paper

Photolithography For Integrated Thin Film Read/Write Heads
Author(s): J.-S. Gau
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Paper Abstract

The lithographic processes involved in the fabrication of thin film heads are discussed. Because of the intrinsic features of huge topography and high aspect ratio, process requirements for film heads as opposed to semiconductor devices are identified. A process of conformal thick resist coating across a large step height is developed by optimizing resist coating parameters and the use of a resist with higher viscosity. Also planarization techniques are discussed with a specific example illustrated to planarize the topography associated with the fine and large cross-sectional coil pattern. Alignment accuracy proves to be the most critical parameter for further advances in the film head technology and several strategies are proposed to improve the alignment capability.

Paper Details

Date Published: 25 July 1989
PDF: 11 pages
Proc. SPIE 1088, Optical/Laser Microlithography II, (25 July 1989); doi: 10.1117/12.953179
Show Author Affiliations
J.-S. Gau, Imprimis Technology Inc.,/CDC (United States)


Published in SPIE Proceedings Vol. 1088:
Optical/Laser Microlithography II
Burn Jeng Lin, Editor(s)

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