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Proceedings Paper

Recent Advances In Automated Patterned Wafer Inspection
Author(s): Rod Browning; Ian Lincoln; Peter Stonestrom
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Paper Abstract

An automated patterned wafer inspection system has been developed with submicron sensitivity which is capable of inspecting a complete 150mm wafer in less than three and a half minutes. The system was designed to be used on-line in a production environment to assist the process engineer in identifying critical yield limiting process steps. The system can be interfaced to an automated off-line defect review microscope which allows for the classification of defects. An overview of the optical system and unique signal processing techniques will be presented. Performance results on a variety of different process levels on various types of patterned wafers will be discussed.

Paper Details

Date Published: 19 July 1989
PDF: 6 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953117
Show Author Affiliations
Rod Browning, Tencor Instruments (United States)
Ian Lincoln, Tencor Instruments (United States)
Peter Stonestrom, Tencor Instruments (United States)

Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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