Share Email Print

Proceedings Paper

Recent Advances In Automated Patterned Wafer Inspection
Author(s): Rod Browning; Ian Lincoln; Peter Stonestrom
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

An automated patterned wafer inspection system has been developed with submicron sensitivity which is capable of inspecting a complete 150mm wafer in less than three and a half minutes. The system was designed to be used on-line in a production environment to assist the process engineer in identifying critical yield limiting process steps. The system can be interfaced to an automated off-line defect review microscope which allows for the classification of defects. An overview of the optical system and unique signal processing techniques will be presented. Performance results on a variety of different process levels on various types of patterned wafers will be discussed.

Paper Details

Date Published: 19 July 1989
PDF: 6 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953117
Show Author Affiliations
Rod Browning, Tencor Instruments (United States)
Ian Lincoln, Tencor Instruments (United States)
Peter Stonestrom, Tencor Instruments (United States)

Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

© SPIE. Terms of Use
Back to Top