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Proceedings Paper

Displacement Interferometer with High Resolution and Low Sensitivity to Temperature
Author(s): Kenneth J. Wayne
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Paper Abstract

The continuing trend toward smaller geometries in IC lithography is placing increased demands on the displacement transducers used in wafer steppers and inspection machines. Among the needs are improved accuracy, repeatability and resolution. This paper describes a new displacement measuring interferometer which has resolution twice that of conventional plane mirror interferometers as well as improved accuracy and repeatability. These improvements are achieved by double passing the measurement arm and optically compensating the thermal drift error inherent in other plane mirror interferometer designs. This drift arises from small changes in ambient temperature and if not eliminated can be significant even in a temperature controlled environment. The origin of thermal drift error in plane mirror interferometers is analyzed and comparative test results are discussed.

Paper Details

Date Published: 19 July 1989
PDF: 9 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953115
Show Author Affiliations
Kenneth J. Wayne, Hewlett-Packard Company (United States)


Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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