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Proceedings Paper

Advanced Manufacturing Techniques As Applied To ASIC Photolithographic Processing
Author(s): Daniel C. Carter; Brian P. Bystedt
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Paper Abstract

An advanced manufacturing photolithographic process has been developed and implemented. Utilizing conventional processing techniques the process demonstrates high levels of consistency and uniformity while maintaining simplicity. The 1.5 micron process as monitored by electrical metrology techniques has demonstrated long term consistency of exposure latitude and critical dimension uniformity. All aspects of processing including coat, expose, develop and etch contribute to a total variation of less than 10% of nominal linewidth. Statistical process control combined with equipment matching has facilitated process standardization and allows for the elimination of all pilots and set-up wafers bringing high throughput ASIC manufacturing to a reality.

Paper Details

Date Published: 19 July 1989
PDF: 11 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953099
Show Author Affiliations
Daniel C. Carter, NCR Corporation (United States)
Brian P. Bystedt, NCR Corporation (United States)


Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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