Share Email Print

Proceedings Paper

Combining Electrical Defect Monitors with Automatic Visual Inspection Systems
Author(s): Christopher W. Teutsch; David C. Drain
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

As defect densities decrease, ever increasing sample areas will be required for statistically valid estimates of defect densities. Several tools exist, such as electrical defect monitors (serpentines and combs), that can test a large area but provide little information about the defects detected. At the same time, automated visual inspection techniques (KLA 2028) exist that inspect smaller areas with greater detail. We propose a strategy for analyzing large areas with great detail by combining both of these tools. The necessity of obtaining visual information for process evaluations is discussed. Experimental results are described in support of this strategy.

Paper Details

Date Published: 19 July 1989
PDF: 11 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953092
Show Author Affiliations
Christopher W. Teutsch, Intel Corporation (United States)
David C. Drain, Intel Corporation (United States)

Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

© SPIE. Terms of Use
Back to Top