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Proceedings Paper

Characterization of Automated Wafer Inspection Tools
Author(s): Rick Wallace; Gary Dickerson
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Paper Abstract

With some companies now ramping up production of the 4 Mbit DRAM, the era of submicron device technology has begun. To produce each new device with an acceptable yield, there is a requirement for a decrease in defect density in comparison to previous generations of technology as shown in the figure 1.

Paper Details

Date Published: 19 July 1989
PDF: 9 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953091
Show Author Affiliations
Rick Wallace, KLA Instruments Corp. (United States)
Gary Dickerson, KLA Instruments Corp. (United States)


Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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