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Proceedings Paper

Effect Of Resist Side-Wall Slope Variations On Confocal Optical Metrology
Author(s): J. McCall; R. DeRosa; E. A. Peltzer; I. R. Smith; R. Nielson
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Paper Abstract

This paper presents results from an experimental study of the effects of resist side-wall slope variations on the linewidth measurement accuracy of a Confocal Scanning Laser Microscope (CSLM), as compared with a Scanning Electron Microscope (SEM). Both the top and bottom dimensions of patterned resist features from 0.51 μm to 2.0 μm wide were measured using CSLM, cross-sectional SEM and on-axis SEM. Substrates tested included bare silicon and three thicknesses of oxide on silicon. The resist was patterned with a range of deliberate stepper defocus which provided a 15° variation in side-wall angle. Data for the three methods is compared and shows that in this case the CSLM demonstrated good measurement accuracy for independent top and bottom width measurements. Errors due to resist sidewall slope variation were small, random and consistent with the experimental noise level.

Paper Details

Date Published: 19 July 1989
PDF: 10 pages
Proc. SPIE 1087, Integrated Circuit Metrology, Inspection, and Process Control III, (19 July 1989); doi: 10.1117/12.953085
Show Author Affiliations
J. McCall, SiScan Systems (United States)
R. DeRosa, SiScan Systems (United States)
E. A. Peltzer, SiScan Systems (United States)
I. R. Smith, SiScan Systems (United States)
R. Nielson, Dynachem (United States)


Published in SPIE Proceedings Vol. 1087:
Integrated Circuit Metrology, Inspection, and Process Control III
Kevin M. Monahan, Editor(s)

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