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Proceedings Paper

Surface Characterization Of Aluminum Substrates Exposed To Photoresist Developers
Author(s): K. A. Graziano; C. S. Allen; Hua-Yu Liu
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Paper Abstract

Surface composition of aluminized substrates after exposure to sodium silicate buffered and non-buffered alkaline developers is described. Variable angle x-ray photoelectron scattering (XPS) reveals that sodium silicate buffered alkaline developers form a protective aluminosilicate film on the wafer surface which inhibits aluminum erosion. The elemental composition and possible mechanisms of film formation are presented. Aluminum-copper alloy sputtered wafers are more susceptible to etch by non-buffered alkaline developers than non-alloyed aluminum sputtered wafers.

Paper Details

Date Published: 30 January 1989
PDF: 11 pages
Proc. SPIE 1086, Advances in Resist Technology and Processing VI, (30 January 1989); doi: 10.1117/12.953046
Show Author Affiliations
K. A. Graziano, Rohm and Haas Co. (United States)
C. S. Allen, Rohm and Haas Co. (United States)
Hua-Yu Liu, Hewlett-Packard Co. (United States)


Published in SPIE Proceedings Vol. 1086:
Advances in Resist Technology and Processing VI
Elsa Reichmanis, Editor(s)

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