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Proceedings Paper

Materials And Technologies For Microstructure Engineering
Author(s): R. L. Smith; S. D. Collins
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Paper Abstract

The fabrication of microstructures for sensing and actuating has evolved in the last few years to include special technologies and materials, not commonly used in the integrated circuit industry, but which are, at least to some degree, compatible with those planar structures. Microsensors and actuators are now more frequently being constructed in the third dimension to enable mechanical motion, or to incorporate packaging components. This paper presents some of the materials and technologies for microstructure engineering which are being developed and implemented in current microsensor designs.

Paper Details

Date Published: 8 August 1989
PDF: 8 pages
Proc. SPIE 1068, Catheter-Based Sensing and Imaging Technology, (8 August 1989); doi: 10.1117/12.952151
Show Author Affiliations
R. L. Smith, University of California (United States)
S. D. Collins, University of California (United States)

Published in SPIE Proceedings Vol. 1068:
Catheter-Based Sensing and Imaging Technology
Alan I. West, Editor(s)

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