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Proceedings Paper

Void Detection In Metals Using Heat Flow Parallel To The Target Surface
Author(s): G. L. Orlove; R. P. Madding; C. P. Burger; B. Raj
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Paper Abstract

This paper discusses a new technique to locate voids in high conductivity materials such as metals. Heat is applied parallel to the target surface (perpendicular to viewing direction). A thermal contour display (produced by a thermal imaging system) of the material under test shows a distinct "pinch" produced by a void. This thermal pinch is persistent and is not always destroyed by high lateral conductivity. This new technique promises to open a whole new realm of thermographic applications.

Paper Details

Date Published: 28 March 1986
PDF: 3 pages
Proc. SPIE 0581, Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control, (28 March 1986); doi: 10.1117/12.950880
Show Author Affiliations
G. L. Orlove, Inframetrics Inc. (United States)
R. P. Madding, Inframetrics Inc. (United States)
C. P. Burger, Iowa State University (United States)
B. Raj, Iowa State University (United States)

Published in SPIE Proceedings Vol. 0581:
Thermosense VIII: Thermal Infrared Sensing for Diagnostics and Control
Herbert Kaplan, Editor(s)

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