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Proceedings Paper

A Repair Machine For VLSI Using Laser Induced Micro-Chemistry
Author(s): G. Auvert; D. Tonneau; Y. Guern; G. Pelous
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Paper Abstract

Laser assisted direct writing for in situ etching and deposition may find applications in integrated circuit repair or adjustment. Recent work, performed by this team, on basic processes for deposition of metals and insulators and for etching materials currently in use in microelectronics, will be reviewed. This paper is to describe the last developments of an IC repair prototype, designed to draw 2 micron wide lines on Silicon using a focused CW Argon ion laser beam. As deposition mechanism is mainly pyrolytic, deposit shapes have been evaluated starting from experimental deposition kinetics and 3D finite element temperature distribution computation. General concepts of the machine to meet the conflicting requirements of obtaining a micron size laser spot over a full 150 mm Si wafer enclosed in a controlled atmosphere will be presented. Possible processes will be outlined and applications reviewed.

Paper Details

Date Published: 10 April 1989
PDF: 7 pages
Proc. SPIE 1022, Laser Assisted Processing, (10 April 1989); doi: 10.1117/12.950101
Show Author Affiliations
G. Auvert, CNET (France)
D. Tonneau, BERTIN & Cie (France)
Y. Guern, BERTIN & Cie (France)
G. Pelous, BERTIN & Cie (France)


Published in SPIE Proceedings Vol. 1022:
Laser Assisted Processing
Lucien Diego Laude; Gerhard K. Rauscher, Editor(s)

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