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Proceedings Paper

In Situ Resolution and Overlay Measurement on a Stepper
Author(s): T. A. Brunner; R. R. Allen
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Paper Abstract

A direct means of observing both the location and the shape of the aerial image of a microlithographic stepper lens is described. Sub-micron resist structures, doped with a fluorescent dye, are swept through the aerial image as fluorescence is monitored. The resolution of this technique is not limited by optical wavelengths, but rather depends on the width of the fluorescent resist structures. Data are reported on the resolution and overlay error of a 5X reduction stepper. 60 hertz vibrational motions of the projected image with respect to the wafer were observed with peak to peak amplitudes as large as 0.3 microns.

Paper Details

Date Published: 2 January 1986
PDF: 8 pages
Proc. SPIE 0565, Micron and Submicron Integrated Circuit Metrology, (2 January 1986); doi: 10.1117/12.949726
Show Author Affiliations
T. A. Brunner, Xerox PARC (United States)
R. R. Allen, Xerox PARC (United States)


Published in SPIE Proceedings Vol. 0565:
Micron and Submicron Integrated Circuit Metrology
Kevin M. Monahan, Editor(s)

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