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Proceedings Paper

Precision Measurements Of Material-Removal Rates In Superpolishing Sapphire
Author(s): B. Hader; O. Weis
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Paper Abstract

As we demonstrate, sapphire can be polished by means of colloidal SiO2 (7 nmφ) in water by direct contact to a tin lap to a residual roughness better than 0.3 nm Rz measured with a Talystep profilometer. We use the superpolishing mechanism itself for producing microscopically smooth grooves which can serve for a precision measurement of the very small removal rates intrinsic to the superpolishing process. In order to explain the superpolishing process, we propose the model of hydrothermal wear.

Paper Details

Date Published: 11 April 1989
PDF: 10 pages
Proc. SPIE 1015, Micromachining Optical Components and Precision Engineering, (11 April 1989); doi: 10.1117/12.949456
Show Author Affiliations
B. Hader, Universitat Ulm (Federal Republic of Germany)
O. Weis, Universitat Ulm (Federal Republic of Germany)


Published in SPIE Proceedings Vol. 1015:
Micromachining Optical Components and Precision Engineering
Peter Langenbeck, Editor(s)

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