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Proceedings Paper

Dissolution Rate Studies Of Some Metal-Ion-Free Developers During Various Modes Of Automated Spray Development
Author(s): John S. Petersen; Alan Kozlowski; Kim Eastwood; Mary Kay Swan; Mike Stan
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Paper Abstract

Previous work has shown Microposit 1400-27/MF-314 resist/developer systems to have high chemical contrast, Gamma >3, and that the contrast was tunable o some degree.' This high contrast was thought to be the result of an inhibition effect. However, SEM analysis of overdeveloped resist images did no show the characteristic underigutting associated with systems which exhibit this effect. Dissolution studies of S140027/MF-314 in immersion mode of development showed appreciable inhibition at low exPosure dose, but contrast was not as high as observed in spray. The latter result suggested the inhibition effect was being masked and that dissolution studies must be conducted during spray development to de-termine its magnitude. To do this work a HeNe laser dissolution rate monitoring aooaratus was attached to a GCA 9000 aspirated spray developer module. Using this apoaratus, the develonment of S1400-27 in both MF-314 and MF2312 CD-27 was examined during spray and puddle modes of develooment. Also, to gather more information on contrast tuning, MF-314 was examined in a spray/puddle process. In this study, it is shown that S1400-27 photoresist developed with MF-314 does exhibit appreciable inhibition during development in spray and puddle. However at higher exposure dosage, except for enhanced dissolution rates, the inhibition effect with MF-314 is comparable to MF-312 CD-27 developer. It is also shown that resist developed with MF-3l2 CD-27 behaves similarly in both spray and immersion modes of development. A brief description of the dissolution monitoring apparatus is also included.

Paper Details

Date Published: 18 April 1985
PDF: 7 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947844
Show Author Affiliations
John S. Petersen, Shipley Company Inc. (United States)
Alan Kozlowski, Shipley Company Inc. (United States)
Kim Eastwood, Shipley Company Inc. (United States)
Mary Kay Swan, Shipley Company Inc. (United States)
Mike Stan, Shipley Company Inc. (United States)


Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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