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Proceedings Paper

In-Line Automatic Photoresist Process Control
Author(s): L. Lauchlan; K. Sautter; T. Batchelder; J. Irwin
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Paper Abstract

Control of optically printed linewidths becomes increasingly difficult as diffraction effects degrade image quality. If, during development, the exposed film thickness is monitored by optical detection of interference fringes, it is possible to find the time at which the photoresist breaks through to the substrate. When this time is related to the total development time needed to print a given feature size, it is possible to automatical-ly adjust the total development time to correct for process drifts in dose, resist thickness or soft bake temperature. This paper will describe a method for in-line, automatic linewidth control for both spray and puddle development. This equipment can also be used in a process diagnostic mode to evaluate such photoresist parameters as the resist dissolution rate or initiation time before development actually begins. The implications of this tool for fully automated photoresist processing will be discussed.

Paper Details

Date Published: 18 April 1985
PDF: 7 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947837
Show Author Affiliations
L. Lauchlan, GCA Corporation (United States)
K. Sautter, GCA Corporation (United States)
T. Batchelder, GCA Corporation (United States)
J. Irwin, GCA Corporation (United States)

Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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