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Proceedings Paper

Image Reversal Of Positive Photoresist A New Tool For Advancing Integrated Circuit Fabrication
Author(s): Eric Ailing; Craig Stauffer
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Paper Abstract

In the struggle to attain denser and higher speed devices through reducing feature sizes companies are facing thresholds beyond which conventional photolithography cannot transcend. Enormous financial commitments have been made by semiconductor device fabricators in their drive to produce devices centered on 1.5μ design rules. The purchase of ever more sophisticated alignment and peripheral processing equipment, costly photoresist changes, and massive investments in engineering has enabled many companies to participate in this race. This compulsory buying of next year's model will not necessarily bring companies through the difficult technological times ahead!

Paper Details

Date Published: 18 April 1985
PDF: 25 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947835
Show Author Affiliations
Eric Ailing, Imtec (United States)
Craig Stauffer, Imtec (United States)

Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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