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Proceedings Paper

Recent Advances In Photoimagable Polyimides
Author(s): O. Rohde; M. Riediker; A. Schaffner; J. Bateman
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Paper Abstract

To date the use of photoimagable polyimide systems has been limited by lack of photo-speed, excessive volume contraction, and by shelf-life problems. These shortcomings have now been improved to the point where a practical, usable system has become available. Through the use of novel high quantum yield sensitizers, tailored to the g-line (436 nm) of the mercury spectrum, it is now possible to lower exposure times markedly and to reduce the amount of layer shrinkage that occurs in the final cure. Layers up to 70 microns and more of final cured polyimide can be photostructured at high resolution with an exposure energy of less than 1 J/cm2. The system presented is particularly useful for relatively thick layer applications as, for example, alpha particle protection, but can be used also for thin layer applications with accordingly shorter exposure times.

Paper Details

Date Published: 18 April 1985
PDF: 7 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947831
Show Author Affiliations
O. Rohde, CIBA-GEIGY AG (Switzerland)
M. Riediker, CIBA-GEIGY AG (Switzerland)
A. Schaffner, CIBA-GEIGY AG (Switzerland)
J. Bateman, CIBA-GEIGY Corporation (United States)

Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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