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Proceedings Paper

Improvements To The Dry-Etch Resistance Of Sensitive Positive-Working Electron Resists
Author(s): Edward D. Roberts
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Paper Abstract

A positive-working electron resist, poly-(methacryloyl chloride), which has sensitivity ≈5 μC/cm2 at 20 keV is described. The resist is slightly more resistant to erosion in a carbon tetrachloride-based plasma than is poly-(methyl methacrylate). Its erosion rate in the plasma can be further reduced by treating developed film patterns with suitable reagents to introduce into the resist structure aromatic groups or metals. Erosion rates can be reduced to values near those of negative resists containing aromatic groups.

Paper Details

Date Published: 18 April 1985
PDF: 7 pages
Proc. SPIE 0539, Advances in Resist Technology and Processing II, (18 April 1985); doi: 10.1117/12.947824
Show Author Affiliations
Edward D. Roberts, Philips Research Laboratories (England)


Published in SPIE Proceedings Vol. 0539:
Advances in Resist Technology and Processing II
Larry F. Thompson, Editor(s)

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