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Proceedings Paper

Automated Wafer Inspector Characterization
Author(s): Karl L. Harris; Raleigh Estrada; Paul Sandland; Russ M. Singleton
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Paper Abstract

Several specific aspects of a new multi-functional automatic wafer inspection system are discussed and characterization data presented. Li-near dimensional measurement data are presented illustrating system precision and accuracy. The probability of detecting different types of defects is presented for two different pixel sizes. A new method of providing a design or CAD reference, one of three alternative references, is shown.

Paper Details

Date Published: 23 July 1985
PDF: 9 pages
Proc. SPIE 0538, Optical Microlithography IV, (23 July 1985); doi: 10.1117/12.947758
Show Author Affiliations
Karl L. Harris, KLA Instruments Corporation (United States)
Raleigh Estrada, KLA Instruments Corporation (United States)
Paul Sandland, KLA Instruments Corporation (United States)
Russ M. Singleton, KLA Instruments Corporation (United States)


Published in SPIE Proceedings Vol. 0538:
Optical Microlithography IV
Harry L. Stover, Editor(s)

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