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Proceedings Paper

Mixing 1X Scanning And 5X Step-And-Repeat Exposure Systems In A Semiconductor Processing Line
Author(s): W. Carpenter; J. LaRue; R. Chappelow
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Paper Abstract

VLSI products require extremes in lithographic capabilities. Several masking levels typically demand leading-edge lithographic capabilities, while a number of other levels typically have less stringent requirements (approximately 5pm). Similar statements may be made regarding typical overlay requirements. This leads to the consideration of mixing 1X aligners with step-and-repeat 5X reduction systems. The objective of this procedure is to minimize costs and meet lithographic requirements with increased real-time throughput. There are three key issues to be dealt with: 1) Mixed tool set overlay, 2) Relative process/tool cost considerations, 3) Logistics of line operation. This paper describes mixed-tool set overlay results and a description of the techniques used to minimize them.

Paper Details

Date Published: 23 July 1985
PDF: 8 pages
Proc. SPIE 0538, Optical Microlithography IV, (23 July 1985); doi: 10.1117/12.947745
Show Author Affiliations
W. Carpenter, IBM General Technology Division (United States)
J. LaRue, IBM General Technology Division (United States)
R. Chappelow, IBM General Technology Division (United States)

Published in SPIE Proceedings Vol. 0538:
Optical Microlithography IV
Harry L. Stover, Editor(s)

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