Proceedings PaperDouble Telecentric Wafer Stepper Using Laser Scanning Method
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A stepper of new concept has been developed. It uses double telecentric lens and TTL laser scanning method. It is TTL on axis stepper in the ture sense, because alignment is checked directly before exposure. The projection optics can resolve 1.0 μm in production and has small distortion. The alignment accuracy within 0.25 μm ( 3 o) is achieved.