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Proceedings Paper

High Frequency Characterization Of Tape-Automated Bonding (TAB) Interconnects
Author(s): S. M. Wentworth; D. P. Neikirk; C. R. Brahce
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Paper Abstract

The geometry of tape automated bonding (TAB) tape lends itself to microwave packaging applications where high density signal lines are required. in this paper we model the tape as a transmission line, since above 5 GHz the tape length is significant compared to the signal wavelength. A test chip has been fabricated to allow determination of the microwave characteristics of 3M's 120 lead, two-layer gold-plated ED copper tape, which has a polyimide support layer and an inner lead pitch of 8 mils. A characteristic impedance of 100 ± 10 Ω is found for the tape based upon measurements up to 18 GHz. This compares well with the theoretical model, which predicts an impedance between 98 and 118 . Theoretical models and practical considerations have been used to design a TAB tape which should be impedance matched to 50 Ω and exhibit good signal isolation. This design is presented, and the tape is currently being manufactured.

Paper Details

Date Published: 8 September 1988
PDF: 4 pages
Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); doi: 10.1117/12.947451
Show Author Affiliations
S. M. Wentworth, University of Texas at Austin (United States)
D. P. Neikirk, University of Texas at Austin (United States)
C. R. Brahce, 3M Corporation (United States)

Published in SPIE Proceedings Vol. 0947:
Interconnection of High Speed and High Frequency Devices and Systems
Alfred P. DeFonzo, Editor(s)

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