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Proceedings Paper

Microwave Interconnects Via Electromagnetic Coupling
Author(s): John J. Burke; Robert W. Jackson
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Paper Abstract

Two transitions are described which couple coplanar waveguide on one substrate surface (a motherboard) to either coplanar waveguide or microstrip on another substrate surface (a chip). No wire bonds are necessary. A coupled transmission line model, along with a full wave analysis, is used to predict the behavior of these transitions. Experimental results show good agreement with predictions in cases where the coupler length to width ratio is not too small.

Paper Details

Date Published: 8 September 1988
PDF: 8 pages
Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); doi: 10.1117/12.947449
Show Author Affiliations
John J. Burke, University of Massachusetts (United States)
Robert W. Jackson, University of Massachusetts (United States)


Published in SPIE Proceedings Vol. 0947:
Interconnection of High Speed and High Frequency Devices and Systems
Alfred P. DeFonzo, Editor(s)

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