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Proceedings Paper

Analysis And Modeling Of Interconnections And Propagation Structures In High Speed And High Frequency Circuits
Author(s): V. K. Tripathi; A. Hill
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Paper Abstract

The analysis and circuit modeling of multiple coupled strips which are used to model interconnections in a general layered high speed digital or high frequency analog circuit is presented. The structures are analyzed in terms of their self and mutual capacitance, inductance, conductance and resistance matrices per unit length and the normal mode parameters of the coupled system. These normal mode parameters are derived from the line constant matrices for the quasi-TEM case and directly by solving for the eigenvalues, eigenvectors and eigenfunctions for the general full wave-dynamic case. Techniques to synthesize equivalent circuits compatible with CAD programs (e.g., SPICE) are presented with examples of single and coupled lines. Finally examples and results for the normal mode parameters equivalent circuit models and step response of multiple coupled lines are included to demonstrate the frequency dependence of these parameters and the signal propagation characteristics and crosstalk in multiple parallel interconnects.

Paper Details

Date Published: 8 September 1988
PDF: 11 pages
Proc. SPIE 0947, Interconnection of High Speed and High Frequency Devices and Systems, (8 September 1988); doi: 10.1117/12.947448
Show Author Affiliations
V. K. Tripathi, Oregon State University (United States)
A. Hill, Oregon State University (United States)


Published in SPIE Proceedings Vol. 0947:
Interconnection of High Speed and High Frequency Devices and Systems
Alfred P. DeFonzo, Editor(s)

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