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Proceedings Paper

Laser Processing Of Semiconductors - A Production Machine
Author(s): Leslie L. Burns; Arthur R. Elsea
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Paper Abstract

Laser processing of semiconductors offers the promise of fast turn around of custom chips. Already lasers are used for mask repair and as a heat source for some thermal processes at the wafer level. This paper describes the development of a machine for the purpose of customizing gate arrays by using a laser as a point source of heat to cause various thermal reactions at the semiconductor surface.

Paper Details

Date Published: 16 August 1988
PDF: 6 pages
Proc. SPIE 0945, Advanced Processing of Semiconductor Devices II, (16 August 1988); doi: 10.1117/12.947396
Show Author Affiliations
Leslie L. Burns, Lasa Industries, Incorporated (United States)
Arthur R. Elsea, Lasa Industries, Incorporated (United States)


Published in SPIE Proceedings Vol. 0945:
Advanced Processing of Semiconductor Devices II
Harold G. Craighead; Jagdish Narayan, Editor(s)

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