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Proceedings Paper

Surface Quality Requirements And Inspection Techniques For Semiconductor Slices
Author(s): Detlef Reimann
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Paper Abstract

Modern semiconductor device technology imposes increasing demands on the surface perfection of polished and epitaxial silicon slices. These requirements along with the need for statistical process control call for improved objective, automated and quantifiable inspection techniques. An overview is given over various imperfections of polished and epitaxial silicon slices. Current prevailant inspection techniques are discussed with emphasis on their shortcomings regarding the above mentioned requirements.

Paper Details

Date Published: 3 September 1985
PDF: 7 pages
Proc. SPIE 0525, Measurement and Effects of Surface Defects & Quality of Polish, (3 September 1985); doi: 10.1117/12.946351
Show Author Affiliations
Detlef Reimann, Wacker-Chemitronic Gesellschaft fur Elektronic-Grundstoffe mbH (Germany)


Published in SPIE Proceedings Vol. 0525:
Measurement and Effects of Surface Defects & Quality of Polish
Lionel R. Baker; Harold E. Bennett, Editor(s)

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