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Proceedings Paper

Submicron E-Beam Lithography Utilizing A Positive Novolac-Based Resist
Author(s): Patrick P Tang
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Paper Abstract

A positive novolac-based resist, WX-214, developed by Olin Hunt Chemical, has been investigated for use with the commercial electron beam lithography systems, AEBLE 150 and MEBES® III. The WX-214 yielded a sensitivity of 16 pC/cm2, a high resolution of 0.25μm lines and spaces, and an excellent dry etching resistance for pattern transfer. The results on the characterization of the resist and the development of a process for thin and thick films are presented.

Paper Details

Date Published: 14 June 1988
PDF: 7 pages
Proc. SPIE 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII, (14 June 1988); doi: 10.1117/12.945644
Show Author Affiliations
Patrick P Tang, Perkin-Elmer Corporation (United States)


Published in SPIE Proceedings Vol. 0923:
Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII
Arnold W. Yanof, Editor(s)

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