Proceedings PaperInfrared Thermography As An Aid In Quantitative Reliability And Risk Analyses
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An attempt is made to show how Infrared Thermography may effectively aid in yielding realistic assessments of both hardware and human reliability parameters, such as failure/ error rates, corresponding to working conditions actually sensitive to and/or reflected in the existing thermal environment, which usually are not explicitly and specifically accounted for in current quantitative reliability and risk analyses. An analysis, emphasizing first principles and measurable phenomena, is made conducive to characterize specific functional relationships between the relevant thermal patterns and those reliability parameters which may lead to the actual assessment of the latter. The application of this analysis to fault/failure mode diagnosis, and both preventive maintenance and risk analysis is also addressed.