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Proceedings Paper

A Buttable 2048 X 96 Element TDI Imaging Array
Author(s): Joseph P. Ellul; Hak Y. Tsoi; James J . White; Michael I. H.; William C. Bradley; Donald W. Colvin
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Paper Abstract

This paper presents the development of an electro-optic sensor used in the assembly of a 130-mm long focal plane array. The sensor is a buttable 2048 x 96 element TDI (Time Delay and Integrate) CCD imager. The design, architecture and processing of this optical imager are described, as are particular problems associated with buttability and assembly requirements. The tap structures used for high frequency data acquisition are briefly discussed. The feasibility of this high-speed system for imaging of large land areas with high resolution and sensitivity, even under low optical contrast, is demonstrated. The performance specification data is presented.

Paper Details

Date Published: 8 November 1984
PDF: 11 pages
Proc. SPIE 0501, State-of-the-Art Imaging Arrays and Their Applications, (8 November 1984); doi: 10.1117/12.944654
Show Author Affiliations
Joseph P. Ellul, Northern Telecom Electronics (Canada)
Hak Y. Tsoi, Northern Telecom Electronics (Canada)
James J . White, Northern Telecom Electronics (Canada)
Michael I. H., King (Canada)
William C. Bradley, ITEK Optical Systems (United States)
Donald W. Colvin, ITEK Optical Systems (United States)

Published in SPIE Proceedings Vol. 0501:
State-of-the-Art Imaging Arrays and Their Applications
Keith N. Prettyjohns, Editor(s)

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