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Proceedings Paper

Physical Properties Of Ceramic-Glass-Copper Micro-Interconnect Systems For VLSI/VHSIC Packaging Applications
Author(s): D L Shealy; H T Tohver; D A Hill; Z Shehadeh; G Srinivasan; R G Thompson; J Shyu
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Paper Abstract

The demands of increased circuit density and higher signal propagation speeds have combined to substantially increase the importance of micro-interconnect in the packaging of electronic devices. Interconnect and packaging technology have become important factors that limit the performance and reliability of microelectronic devices. To overcome these limitations, many groups 1-6 are considering new materials for microelectronic packaging applications. In this paper, the thermal and electrical properties of partially reactive cordierite and fully reactive cordierite substrates, which have been doped with glass and processed in different manners, will be reported. The dependence of the dielectric constant of the substrate on processing, composition, sintering temperature, and frequency of the applied field from 1KHz to 18GHz will be presented. The thermal conductivity of the substrate as a function of the processing and composition has also been studied. Preliminary data on the bonding of copper microstrips to the ceramic substrate will be reported.

Paper Details

Date Published: 18 May 1988
PDF: 6 pages
Proc. SPIE 0877, Micro-Optoelectronic Materials, (18 May 1988); doi: 10.1117/12.943947
Show Author Affiliations
D L Shealy, University of Alabama at Birmingham (United States)
H T Tohver, University of Alabama at Birmingham (United States)
D A Hill, University of Alabama at Birmingham (United States)
Z Shehadeh, University of Alabama at Birmingham (United States)
G Srinivasan, University of Alabama at Birmingham (United States)
R G Thompson, University of Alabama at Birmingham (United States)
J Shyu, University of Alabama at Birmingham (United States)


Published in SPIE Proceedings Vol. 0877:
Micro-Optoelectronic Materials
Carl A. Kukkonen, Editor(s)

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