Proceedings PaperSemiconductor Wafer Inspection
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The yield of integrated circuit devices made from a semiconductor wafer is known to depend critically on the quality of the bulk material and the perfection of the surfaces generated. Two new quality control instruments which measure infrared strain birefringence and quantify the residual defects, such as digs and scratches and contamination on the surface of the wafer, will be described. Typical results obtained on a variety of wafers will be presented.