Share Email Print
cover

Proceedings Paper

Semiconductor Wafer Inspection
Author(s): Lionel R. Baker
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The yield of integrated circuit devices made from a semiconductor wafer is known to depend critically on the quality of the bulk material and the perfection of the surfaces generated. Two new quality control instruments which measure infrared strain birefringence and quantify the residual defects, such as digs and scratches and contamination on the surface of the wafer, will be described. Typical results obtained on a variety of wafers will be presented.

Paper Details

Date Published: 15 October 1984
PDF: 8 pages
Proc. SPIE 0480, Integrated Circuit Metrology II, (15 October 1984); doi: 10.1117/12.943042
Show Author Affiliations
Lionel R. Baker, Sira Limited (England)


Published in SPIE Proceedings Vol. 0480:
Integrated Circuit Metrology II
Diana Nyyssonen, Editor(s)

© SPIE. Terms of Use
Back to Top