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Proceedings Paper

Noncontact Optical Measuring Methods Of Silicon Wafer Deformation
Author(s): L. Kocsanyi; J. Giber
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Paper Abstract

Deformation measuring methods of 2", 3" diameter silicon wafers are presented. Michelson interferometer and moire method were used to determine flatness of the wafers. An in-situ interferometric measuring system was developed to measure continuously the deformation changes of a wafer during heat treatment.

Paper Details

Date Published: 18 January 1985
PDF: 3 pages
Proc. SPIE 0473, Symposium Optika '84, (18 January 1985); doi: 10.1117/12.942410
Show Author Affiliations
L. Kocsanyi, Technical University of Budapest (Hungary)
J. Giber, Technical University of Budapest (Hungary)


Published in SPIE Proceedings Vol. 0473:
Symposium Optika '84
Gabor Lupkovics; Andras Podmaniczky, Editor(s)

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