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Proceedings Paper

Interconnects For VHSIC Packaging
Author(s): D. E. Craley; L. R. Megargel; M. A. Mentzer; D. H. Naqhski
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Paper Abstract

The limitations of conventional interconnects and switching technology are rapidly becoming critical issues in the throughput of data within high-speed signal processors using VHSIC/VLSI chips or GaAs integrated circuits. Optical interconnect technology promises to significantly enhance signal processing systems and provide relief from pinout, physical proximity, and clocking problems. Furthermore, by releasing the bandwidth constraints imposed by electrical interconnects, the full processing capability of VHSIC chips could be exploited to improve currently fielded systems. Practical interconnection at the intraboard, backplane, and cabinet levels of signal processor systems can now be realized with optical interconnects.

Paper Details

Date Published: 10 March 1988
PDF: 10 pages
Proc. SPIE 0835, Integrated Optical Circuit Engineering V, (10 March 1988); doi: 10.1117/12.942372
Show Author Affiliations
D. E. Craley, ISC Defense Systems, Incorporated (United States)
L. R. Megargel, ISC Defense Systems, Incorporated (United States)
M. A. Mentzer, ISC Defense Systems, Incorporated (United States)
D. H. Naqhski, ISC Defense Systems, Incorporated (United States)

Published in SPIE Proceedings Vol. 0835:
Integrated Optical Circuit Engineering V
Mark A. Mentzer, Editor(s)

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