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Proceedings Paper

Automatic X-Ray Alignment System For Submicron VLSI Printing
Author(s): B Fay; W T Novak; I Carlsson
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Paper Abstract

An automatic, tri-field registration system is described, as used in an automatic wafer exposure system2, for wafers up to 100 mm diameter featuring a high power stationary anode X-ray source (Pd target). The system provides automatic registration and run out compensation based upon the use of Fresnel zone plate alignment targets. First, the basic concepts of the alignment method using circular Fresnel zone plates are presented. The complete alignment system is then described including machine hardware, software, and system operation. Finally, system results of overlay performance obtained with the registration system are given.

Paper Details

Date Published: 18 June 1984
PDF: 6 pages
Proc. SPIE 0471, Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III, (18 June 1984); doi: 10.1117/12.942331
Show Author Affiliations
B Fay, Micronix Corporation (United States)
W T Novak, Micronix Corporation (United States)
I Carlsson, Micronix Corporation (United States)


Published in SPIE Proceedings Vol. 0471:
Electron-Beam, X-Ray, and Ion-Beam Techniques for Submicrometer Lithographies III
Alfred Wagner, Editor(s)

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