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Proceedings Paper

Process Control By Automated In-Process Wafer Inspection
Author(s): K L Harris; P Sandland; R M Singleton
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Paper Abstract

This is the introduction of new technology developed specifically for the inprocess pattern inspection and measurement of very large scale integrated (VLSI) wafers. There is a current need for significant improvements in pattern inspection instrumentation in order to tighten process control and achieve more competitive yields and therefore die costs. For the tedious and detailed task of pattern inspection and measurement, automation is the indicated solution. The future of computerized manufacturing requires, most fundamentally, the automation of the instrumentation and control function. In this paper, a system, designated the KLA 2020 Wafer Inspector, is described which incorporates the basic functions required to measure variations in the patterning process: linear and area dimensional measurements, registration error measurement, comparison for defects down to submicron in size. It is capable of inspecting in-process wafers in order to gain the most immediate process feedback. The speed with which it does each of these tests, less than a second, allows significant increases in sample size and therefore statistical control. It is this technology which will make computer-controlled photo processing possible.

Paper Details

Date Published: 29 June 1984
PDF: 8 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941925
Show Author Affiliations
K L Harris, KLA Instruments Corporation (United States)
P Sandland, KLA Instruments Corporation (United States)
R M Singleton, KLA Instruments Corporation (United States)


Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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