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Proceedings Paper

Automatic Self-Testing Of Machine-To-Machine Matching Of Wafer Steppers
Author(s): Paul Swanson; Gerald Alonzo; Jim Dey
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Paper Abstract

Measuring the overlay registration of wafer steppers is often a tedious, time-consuming task that is subject to inaccuracy and operator subjectivity. Electrical measurements of overlay can be quite accurate, but they require special equipment that is often not found in a wafer fab area, and there can be an undesirable delay before the results of the tests can be obtained. This paper describes a technique that can be used to quickly and automatically measure the overlay registration of multiple steppers on a wafer fab line. By analysis of the test results, it is possible to identify the specific sources of some of the overlay errors. Variations in the stage stepping patterns from one machine to another can be reduced by using the results of the tests to cause the machines to emulate the stepping pattern of a desired standard.

Paper Details

Date Published: 29 June 1984
PDF: 9 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941913
Show Author Affiliations
Paul Swanson, Eaton Microlithography Systems Division (United States)
Gerald Alonzo, Eaton Microlithography Systems Division (United States)
Jim Dey, Eaton Microlithography Systems Division (United States)


Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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