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Proceedings Paper

A Broadband Deep UV Pellicle For 1:1 Scanning Projection And Step And Repeat Lithography
Author(s): Irl E Ward; Dawn L Duly
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Paper Abstract

The use of pellicles as protection for photo masks and reticles to increase die yield, has become increasingly accepted in the semiconductor industry. To meet the changing needs of this industry with the more rigorous requirements of ever-decreasing geometries and lower wavelengths of exposure, a new type of pellicle had to be designed. This pellicle had to meet or exceed all the physical and mechanical requirements of the state-of-the-art pellicles, while combining a superior transmission that permits its use not only in the near-UV, but also in the mid-UV and deep-UV regions and for both steppers and projection aligners.

Paper Details

Date Published: 29 June 1984
PDF: 10 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941905
Show Author Affiliations
Irl E Ward, J.T. Baker Chemical Company (United States)
Dawn L Duly, The Perkin Elmer Corporation (United States)

Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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