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Proceedings Paper

Implementation Of Automatic Alignment Utilizing Electrical Wafer Probe Techniques
Author(s): Robert R. Alien; Myron Cagan; Marti Foster; Talat Hasan
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Paper Abstract

Automatic alignment has been offered by most manufacturers of alignment tools in recent years, and is regarded as essential in acheiving the overlay accuracy required to produce the current generation of fine-line integrated circuits. However, problems associated with the automatic alignment technologies themselves can offset the gains achieved and can, in worst case, actually degrade overall registration performance. Two important problems which must be overcome are: Autoalignment offsets which can cause alignment accuracy to deviate by more than a micron, even though precision is quarter micron or better. 2. Process-dependent variations- causing changes in the topographical and optical characteristics of the alignment keys which can change or degrade the signal produced by the key.

Paper Details

Date Published: 29 June 1984
PDF: 11 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941899
Show Author Affiliations
Robert R. Alien, Xerox Palo Alto Research Center (United States)
Myron Cagan, Xerox Palo Alto Research Center (United States)
Marti Foster, Xerox Palo Alto Research Center (United States)
Talat Hasan, Prometrix Corporation (United States)

Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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