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Proceedings Paper

Fully Automated Alignment For Mos Device Processing On The Model 500 Full-Field Projection System
Author(s): H, Sewell; F. Zernike
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Paper Abstract

In recent years, much attention has been focused on the performance of automatic alignment systems used in the projection printing of semiconductor devices. This is as a result of the progressive tightening of overlay specifications for device processing in response to the ever present pressure to increase device packing density(1-4). This paper reports studies on the performance of the linear array camera automatic fine alignment system on the Model 500 1:1 projection system. The work was carried out on wafers fabricated using an NMOS process sequence, and took the form of an applications study directed at answering the question "What is the overlay performance of the Model 500 projection printer when used in a device production situation?"

Paper Details

Date Published: 29 June 1984
PDF: 8 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941892
Show Author Affiliations
H, Sewell, Consultant (United States)
F. Zernike, Consultant (United States)


Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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