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Proceedings Paper

How Process Technology Can Make Submicron Photolithography Easier : Some Practical Examples.
Author(s): F Buiguez; J P Lazzari; E Tabouret; M. Thouy
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Paper Abstract

For photolithography to become a technique enabling the submicron field to be reached, research work on resist exposure tools and principles is not in itself sufficient. It is also necessary to try to use all the possibilities offered by technological procedures such as coating and dry etching to the full. It is for this reason that we have been led to develop recent microlithography techniques using plasma etching to condition the substrate flatness as well as the etching profiles, and similarly to transfer fine geometries with accurate dimensional control. In this paper, we will present sloping wall etching, planarization and spacer production techniques.

Paper Details

Date Published: 29 June 1984
PDF: 5 pages
Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); doi: 10.1117/12.941880
Show Author Affiliations
F Buiguez, Atomic Energy Commission (France)
J P Lazzari, Atomic Energy Commission (France)
E Tabouret, Atomic Energy Commission (France)
M. Thouy, Atomic Energy Commission (France)

Published in SPIE Proceedings Vol. 0470:
Optical Microlithography III: Technology for the Next Decade
Harry L. Stover, Editor(s)

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