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Proceedings Paper

Resolution Enhancement Of Positive Photoresist Through Optimization Of Thermal Processing
Author(s): Vic Marriott; Yi -Ching Lin; Gene Fuller
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Paper Abstract

Various approaches to resist baking are examined with the objective of increasing the resolution capability of conventional positive resists using standard production exposure tools. Resist prebake, post exposure bake, and deferred bake (soft bake deferred until after exposure) are examined for Shipley Microposit 1400 series photo-resists developed with Microposit MF-312 and MF-314 developers. Temperatures in the range of 60 to 120°C with hot plate and forced air convection baking methods are examined for their effects on enhanced resolution. Conclusions are based on experimental data from studies of development rates, gamma contrast parameter values, exposure latitudes, and sizing control.

Paper Details

Date Published: 21 May 1984
PDF: 7 pages
Proc. SPIE 0469, Advances in Resist Technology I, (21 May 1984); doi: 10.1117/12.941778
Show Author Affiliations
Vic Marriott, Texas Instruments Incorporated (United States)
Yi -Ching Lin, Texas Instruments Incorporated (United States)
Gene Fuller, Texas Instruments Incorporated (United States)

Published in SPIE Proceedings Vol. 0469:
Advances in Resist Technology I
C. Grant Willson, Editor(s)

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