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Proceedings Paper

Some Aspects Of Anti-Reflective Coating For Optical Lithography
Author(s): Yi-Ching Lin; Vic Marriott; Kevin Orvek; Gene Fuller
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Paper Abstract

One major limitation in optical lithography is the resist linewidth variation across steps on a highly reflective substrate. This problem can be alleviated by using an anti-reflective (AR) coating on a planarized multilayer resist surface. A spin-on AR coating provides a simple and economical approach for this purpose. However, the curing of the AR coating is a critical process step. An insufficient bake can result in undesirable undercut of the AR coating, while over baking leads to incomplete development. The coated AR thickness, the baking conditions, the exposure dose, and the development process, among others, interact in a complicated manner to impact the patterning accuracy of the resist/AR layers. In this paper, some aspects of the AR coating will be investigated to address the process complexity. Key interactive parameters will be identified, and a guideline to improve the process latitude will be given.

Paper Details

Date Published: 21 May 1984
PDF: 8 pages
Proc. SPIE 0469, Advances in Resist Technology I, (21 May 1984); doi: 10.1117/12.941774
Show Author Affiliations
Yi-Ching Lin, Texas Instruments Incorporated (United States)
Vic Marriott, Texas Instruments Incorporated (United States)
Kevin Orvek, Texas Instruments Incorporated (United States)
Gene Fuller, Texas Instruments Incorporated (United States)

Published in SPIE Proceedings Vol. 0469:
Advances in Resist Technology I
C. Grant Willson, Editor(s)

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