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Proceedings Paper

Thermal Characteristics Of Bonded Structure Analysis Using Holography And Infrared Thermography
Author(s): Yuwen Wang; Yushan Tan; C. H. Ku
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Paper Abstract

A technique for the fabrication of machine tool structures by epoxy resin bonding has been developed. The design principles and technical factors are discussed from tests of bonded joints. A model fabrication of a lathe spindle box was designed and manufactured. Infrared thermography was used to monitor and calculate the surface temperature distributions of the above structure. And the holographic quantitative analysis of three dimansional displacements was used to measure and calculate the thermal deformation. In this paper the advanced measuring techniques and real-time data of thermal characteristics of the above structure is presented.

Paper Details

Date Published: 17 February 1987
PDF: 7 pages
Proc. SPIE 0814, Photomechanics and Speckle Metrology, (17 February 1987); doi: 10.1117/12.941722
Show Author Affiliations
Yuwen Wang, Xi'an Jiaotong University (China)
Yushan Tan, Xi'an Jiaotong University (China)
C. H. Ku, Xi'an Jiaotong University (China)


Published in SPIE Proceedings Vol. 0814:
Photomechanics and Speckle Metrology
Fu-Pen Chiang, Editor(s)

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