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Proceedings Paper

Photoelastic Measurements Of Residual Stresses For NDE
Author(s): Alex S. Redner
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Paper Abstract

Photoelastic measurements of residual strains are used extensively in the QC and inspection of transparent materials. A new method of measurements, based on Spectral Contents Analysis, is described in this paper. The method uses a personal computer for photoelastic data acquisition, eliminating personal skill and subjectivity. The new tool should make the measurements of residual strains for QC simpler and more reliable.

Paper Details

Date Published: 17 February 1987
PDF: 4 pages
Proc. SPIE 0814, Photomechanics and Speckle Metrology, (17 February 1987); doi: 10.1117/12.941652
Show Author Affiliations
Alex S. Redner, Strainoptic Technologies, Inc. (United States)

Published in SPIE Proceedings Vol. 0814:
Photomechanics and Speckle Metrology
Fu-Pen Chiang, Editor(s)

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