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Proceedings Paper

Simulation Of Thermal Characteristics Of Substrates
Author(s): Nashwa M. Shaalan; Ashraf H. Yahia
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Paper Abstract

Different computational techniques were used to simulate thermal characteristics of nodal points on substrate chips. Multiple distributed thermal disturbances were investigated through thermal resistance calculations among the substrate surface. The simulated results for multiple heat sources are similar to those experimented.

Paper Details

Date Published: 6 October 1987
PDF: 5 pages
Proc. SPIE 0812, Progress in Holography, (6 October 1987); doi: 10.1117/12.941630
Show Author Affiliations
Nashwa M. Shaalan, Ain Shams University (Egypt)
Ashraf H. Yahia, Ain Shams University (Egypt)


Published in SPIE Proceedings Vol. 0812:
Progress in Holography
Jean P. L. Ebbeni, Editor(s)

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