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Proceedings Paper

The Growth Of Platinum Nickel Silicide By Thermal Anneal Of An Alloy Film On Silicon
Author(s): Alan E. Morgan; William T. Stacy; Russell C Ellwanger; Yde Tamminga
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Paper Abstract

The formation of platinum nickel silicide has been studied by sputter depositing a 600 Å Pt.4Ni.6 alloy layer onto (111) n-type Si and annealing for 20 min. in N2 at tempera-tures between 300 and 750°C. RBS, AES and cross-sectional STEM/EDS were used for character-ization. The ternary silicide develops as a two or three layer structure and only at the higher temperatures does a uniform Pt4Ni.6Si layer result. An interfacial monosilicide layer containing mostly Ni is present throughout the growth sequence. The silicide growth mechanism can be understood in terms of metal atom diffusion with the preferential bonding of Si to Pt leaving Ni to diffuse deeper into the Si substrate.

Paper Details

Date Published: 31 May 1984
PDF: 7 pages
Proc. SPIE 0463, Advanced Semiconductor Processing/Characterization of Electronic/Optical Materials, (31 May 1984); doi: 10.1117/12.941344
Show Author Affiliations
Alan E. Morgan, Signetics Corporation (United States)
William T. Stacy, Signetics Corporation (United States)
Russell C Ellwanger, Signetics Corporation (United States)
Yde Tamminga, Philips Research Laboratories (The Netherlands)

Published in SPIE Proceedings Vol. 0463:
Advanced Semiconductor Processing/Characterization of Electronic/Optical Materials
Carl M. Lampert; Devindra K. Sadana, Editor(s)

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