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Proceedings Paper

Wafer Slicing
Author(s): Werner F. Struth; Klaus Steffens; Wilfried Konig
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Paper Abstract

Internal Diameter Sawing is the common used technique for slicing hard and brittle materials, such as semiconductive Silicon, Germanium or ceramics and glasses. Nevertheless, productivity and yield are relative low due to the difficult handling of the flexible tool. Increasing workpiece dimensions lead to increasing problems in realizing quality requirements, such as high flatness, low roughness and low crystal damage. The report deals with basic relationships in I D-Sawing, irrespective of workpiece material (geometry and kinematics) as well as respective to monocrystalline Silicon (cutting mechanism, lattice damage, flatness). Finally guidelines are given to improve process reliability.

Paper Details

Date Published: 11 January 1987
PDF: 7 pages
Proc. SPIE 0803, Micromachining of Elements with Optical and Other Submicrometer Dimensional and Surface Specifications, (11 January 1987); doi: 10.1117/12.941276
Show Author Affiliations
Werner F. Struth, Fraunhofer-Institut fur Produktionstechnologie - IPT (Germany)
Klaus Steffens, Fraunhofer-Institut fur Produktionstechnologie - IPT (Germany)
Wilfried Konig, Fraunhofer-Institut fur Produktionstechnologie - IPT (Germany)


Published in SPIE Proceedings Vol. 0803:
Micromachining of Elements with Optical and Other Submicrometer Dimensional and Surface Specifications
Manfred Weck, Editor(s)

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