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Proceedings Paper

Laser Machining Of Ceramic And Silicon
Author(s): Christoph Hamann; Hans-Georg Rosen
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Paper Abstract

Ceramics and silicon are brittle materials, a fact that may cause problems and at the same time be helpful while machining with lasers. After giving a short introduction to ceramics different ways of cutting and drilling alumina (Al203) and silicon (Si) are discussed and compared to conventional methods. Examples from electronics industry with regard to types of laser, quality and velocity of process are presented.

Paper Details

Date Published: 22 September 1987
PDF: 8 pages
Proc. SPIE 0801, High Power Lasers: Sources, Laser-Material Interactions, High Excitations, and Fast Dynamics, (22 September 1987); doi: 10.1117/12.941232
Show Author Affiliations
Christoph Hamann, SIEMENS AG (Germany)
Hans-Georg Rosen, SIEMENS AG (Germany)


Published in SPIE Proceedings Vol. 0801:
High Power Lasers: Sources, Laser-Material Interactions, High Excitations, and Fast Dynamics
Ernst-Wolfgang Kreutz; A. Quenzer; Dieter Schuoecker, Editor(s)

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