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Proceedings Paper

Beam-Lead Hybridization Technology For Focal Plane Infrared Detectors
Author(s): J. Ameurlaine; A. Gauthier; P. Langle; A. Salaville
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Paper Abstract

A hybridization technology for focal plane infrared detectors was developed. It is based on the user-friendly Beam-Lead hybridization technique which is particularly well suited for work with infrared detectors, such as HgCdTe, which are sensitive to mechanical action during processing. This technology permits high connection density for linear mosaic arrays with beam leads 6 µm length and 14 µm pitch. The beam lead's ability to be bonded to aluminum permits its interface with conventional silicon circuits.

Paper Details

Date Published: 22 April 1987
PDF: 6 pages
Proc. SPIE 0797, Advanced Processing of Semiconductor Devices, (22 April 1987); doi: 10.1117/12.941052
Show Author Affiliations
J. Ameurlaine, Societe Anonyme de Telecommunications (France)
A. Gauthier, Societe Anonyme de Telecommunications (France)
P. Langle, Societe Anonyme de Telecommunications (France)
A. Salaville, Societe Anonyme de Telecommunications (France)

Published in SPIE Proceedings Vol. 0797:
Advanced Processing of Semiconductor Devices
Sayan D. Mukherjee, Editor(s)

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