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Proceedings Paper

Wideband Probing Techniques For Planar Devices: A Review
Author(s): Eric w. Strid
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Paper Abstract

Abstract: A review of high-frequency wafer-probing techniques which use contact to the device under test is given. 50-ohm probes have recently been developed for frequencies up to 50 GHz. On-wafer impedance standards and calibration accuracies have also improved. Probes for high-speed MSI circuits require low-impedance power-supply connections. Probes for non-intrusive measurement of internal IC nodes are also reviewed.

Paper Details

Date Published: 2 February 1988
PDF: 11 pages
Proc. SPIE 0795, Characterization of Very High Speed Semiconductor Devices and Integrated Circuits, (2 February 1988); doi: 10.1117/12.940939
Show Author Affiliations
Eric w. Strid, Cascade Microtech, Inc. (United States)


Published in SPIE Proceedings Vol. 0795:
Characterization of Very High Speed Semiconductor Devices and Integrated Circuits
Ravinder K. Jain, Editor(s)

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